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4 axis laser soldering tin machine

Product application

With the modern reflow process in selective welding, applicability and micro electronic components and connectors, wire USB welding, flexible circuit board or PCB FPC row rigid circuit board welding, high precision of the LCD screen LCD, TFT welding and high frequency transmission lines etc..

Customer Service Hotline

+86-021-3700 9238

Fax :+86-021-57891301

Tel :+86-15901891893

Product introduction Technical parameter Sample display

Product features

● High quality welding laser: imported LD light source, laser PD monitoring to ensure the stability and reliability of the product in the process of processing.

● The sports organization: Taiwan silver ball screw module adopts the machine with high precision, stable performance, and high precision motor motion mechanism. To ensure the reliability and performance of the smooth trajectory.

● The system software can teach programming path, friendly interface, simple, flexible, powerful, simple operation, can be flexible with the other system to realize the automation of link.

● Coaxial CCD positioning and monitoring system, can effectively guarantee the welding precision and yield.

Efficiency: welding speed, especially suitable for reflow soldering production line processing speed.

{"zh":"
设备型号/Model SWC-30/50(可定制/Customizable)
激光功率/laser power 30W/50W(可选/Optional)
激光类型/Laser type 半导体激光器/Semiconductor laser
最小光斑/Minimum spot 40μm
定位方式/Positioning mode 同轴CCD自动定位/Coaxial CCD automatic positioning
运动范围/Range of motion 有效行程/Effective stroke:200*200mm(可定制/Customizable)
焊点尺寸/Solder joint size 0.05~0.80mm
焊接方式/Welding method 单点焊接/Single point welding
上下料方式/Feeding mode 手动或自动/Manual/automatic
工作温度/working temperature 温度:10℃~35℃湿度:5%~85%要求设备应用环境通风无尘/Temperature: 10 ~35,
冷却方式/Cooling method 风冷/Air cooling
电力需求/Power demand 单相/Single-phase:AC220(±10%)/50~60Hz、15A
总功率/Total power <1000W
整机重量/Weight 100Kg
产地/Origin 中国上海(China)
","en":"
设备型号/Model SWC-30/50(可定制/Customizable)
激光功率/laser power 30W/50W(可选/Optional)
激光类型/Laser type 半导体激光器/Semiconductor laser
最小光斑/Minimum spot 40μm
定位方式/Positioning mode 同轴CCD自动定位/Coaxial CCD automatic positioning
运动范围/Range of motion 有效行程/Effective stroke:200*200mm(可定制/Customizable)
焊点尺寸/Solder joint size 0.05~0.80mm
焊接方式/Welding method 单点焊接/Single point welding
上下料方式/Feeding mode 手动或自动/Manual/automatic
工作温度/working temperature 温度:10℃~35℃湿度:5%~85%要求设备应用环境通风无尘/Temperature: 10 ~35,
冷却方式/Cooling method 风冷/Air cooling
电力需求/Power demand 单相/Single-phase:AC220(±10%)/50~60Hz、15A
总功率/Total power <1000W
整机重量/Weight 100Kg
产地/Origin 中国上海(China)
"}
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